







Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4g | CL-O023-GROSGM-A
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Thermaltake TG-30 - Thermal paste - gray. Thermaltake TG-30 - Thermal paste - gray, color: Gray , model: TG-30 , brand name: Thermaltake , manufacturer: THERMALTAKE USA INC. Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs. Key identifiers: P/N CL-O023-GROSGM-A, UPC 841163075845. ProductDimensions (manufacturer): 7 x 3.5 x 0.1 inches. Item Weight (Rainforest): 0.01 Kilograms (≈0.35 ounces). Compatible with CPU and GPU heatsinks; cooler material listed as Aluminum. Model number TG-30.
- [Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking
- [Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
- [All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
- [Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.
Materials & Construction
- Color:Gray
- Material:Aluminum
- Outer Material:Aluminum
Product Details
- Item model number:TG-30
- UPC:841163075845
Sizing & Dimensions
- Height:0.1 inches
- Length:7 inches
- Product Dimensions:7 x 3.5 x 0.1 inches
- Size:4g
- Weight:0.35 ounces
- Width:3.5 inches
Technical Specifications
- Cooler Heatsink Compatibility:CPU, GPU
- CPU Socket:Universal
- Mounting Type:Chassis Mount


